Lanner LVC-5570 Instrukcja Użytkownika

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In-Vehicle Computing
Hardware Platforms for mobile applications
LVC-5570
V1.3
User's Manual
Publication date:2014-07-02
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Strona 1 - LVC-5570

>>In-Vehicle ComputingHardware Platforms for mobile applicationsLVC-5570V1.3User's ManualPublication date:2014-07-02

Strona 2 - Overview

10System ComponentsChapter 2Embedded and Industrial ComputingComponent Description Pin Definition ReferenceF1 HDD (Yellow) and Power LED (Green)HDDBl

Strona 3 - Revision History

11System ComponentsChapter 2Embedded and Industrial ComputingRear ComponentsComponent Description Pin Definition ReferenceR1 Power-In (DC) Power-in w

Strona 4

12System ComponentsChapter 2Embedded and Industrial ComputingComponent Description Pin Definition ReferenceR10 3G Audio (optional) and PC Audio Ports

Strona 5 - Chapter 1

13Board LayoutChapter 3Embedded and Industrial ComputingChapter 3: Board LayoutConnectorsThe following picture highlights the location of the COM por

Strona 6

14Board LayoutChapter 3Embedded and Industrial ComputingIgnition Board ConnectorsThe following picture highlights the location of ignition board con

Strona 7

15Board LayoutChapter 3Embedded and Industrial ComputingExternal ConnectorsThe following picture highlights the location of external input/output conn

Strona 8

16Board LayoutChapter 3Embedded and Industrial ComputingInternal Connectors and JumpersThe following picture highlights the location of internal co

Strona 9

17Board LayoutChapter 3Embedded and Industrial ComputingInternal Connectors and Jumpers (backside)The following picture highlights the location of

Strona 10 - Chapter 2

18Board LayoutChapter 3Embedded and Industrial ComputingConnectors and Jumpers ListThe tables below list the function of each of the board jumpers and

Strona 11

19Board LayoutChapter 3Embedded and Industrial ComputingSCT1, SCT2: Select COM1 Protocol SettingRS-232 RS-422RS-485SwitchProtocolSCT1 SCT2RS-232 (defa

Strona 12

2AboutAboutEmbedded and Industrial ComputingOverviewIcon DescriptionsThe icons are used in the manual to serve as an indication of interest topics

Strona 13 - Chapter 3

20Board LayoutChapter 3Embedded and Industrial ComputingSwitchProtocolSCT3 SCT4RS-232 (default) 1-5, 2-6, 3-7, 4-8 1-2RS-422 5-9, 6-10, 7-11, 8-12 3-4

Strona 14

21Board LayoutChapter 3Embedded and Industrial ComputingDC Relay Bypass (CN2) : 9~30V, 10A DC power input and output Integrated in a 4-pin terminal.S

Strona 15

22Board LayoutChapter 3Embedded and Industrial ComputingFront Panel Function Pin Header (FRONT1): It provides LED signal and button function on the fr

Strona 16

23Board LayoutChapter 3Embedded and Industrial ComputingDVI-D Connector (DVID1): A single link DVI-D ConnectorPin No. Description Pin No. Description1

Strona 17

24Board LayoutChapter 3Embedded and Industrial ComputingMPCIE1: Mini-PCIe Connector with one SIM Card Reader(SIM1). It supports both Wi-Fi and 3

Strona 18

25Board LayoutChapter 3Embedded and Industrial ComputingSIM Card Socket (SIM1):CN3: A power connector with power -ignition ControlDCJK1 (Optional):

Strona 19

26Board LayoutChapter 3Embedded and Industrial ComputingPS/2 Keyboard and Mouse Connector (KBM1)Ignition Connector on Board (ignition1): Power ignitio

Strona 20

27Board LayoutChapter 3Embedded and Industrial ComputingMCU (Microcontroller) Function Selection (SW1, SW2): It is for selecting the microcontroller’s

Strona 21

28Flow ChartChapter 4Embedded and Industrial ComputingChapter 4: The Flow ChartThe flow chart section contains all flow chart used in the system. Th

Strona 22

29Hardware SetupChapter 5Embedded and Industrial ComputingChapter 5: Hardware SetupPreparing the Hardware InstallationTo access some components and p

Strona 23

3AboutAboutEmbedded and Industrial ComputingMechanical compliance Vibration: General Vibration (operating): Refer to MIL-STD-810G, •Method 514.6, Pro

Strona 24

30Hardware SetupChapter 5Embedded and Industrial ComputingNote: To remove the SIM card, slide the card reader outward to unlock it.External

Strona 25

31Hardware SetupChapter 5Embedded and Industrial ComputingInstalling the Hard DiskThe system can accommodate two Serial-ATA disk. Follow these steps t

Strona 26

32Using the Ignition System Manager (ISM)Embedded and Industrial ComputingAppendix AAppendix A: Using the Ignition System Manager (ISM)The Ignition

Strona 27

33Digital Input/Output ControlAppendix BEmbedded and Industrial ComputingAppendix B: Digital Input/Output The Digitanl I/O on the rear panel is desi

Strona 28 - Chapter 4

34Digital Input/Output ControlAppendix BEmbedded and Industrial ComputingChoose to select the hardware Manually8. Choose Show all device and click Nex

Strona 29 - Chapter 5

35Digital Input/Output ControlAppendix BEmbedded and Industrial ComputingSelect the Lanner IO driver and click Next.14. Click Next15. Click 16. Compl

Strona 30

36Digital Input/Output ControlAppendix BEmbedded and Industrial ComputingA sample DIO program in C: ioaccess.c: IO access code for Lanner Platfomr Dig

Strona 31

37Digital Input/Output ControlAppendix BEmbedded and Industrial Computing#include <machine/bus.h>#include <machine/resource.h>#endif#endif

Strona 32 - Appendix A

38Digital Input/Output ControlAppendix BEmbedded and Industrial Computing exit_SIO_config(); return;}void dio_set_output(unsigned char out_val

Strona 33 - Appendix B

39Accessing the Digital Accelerometer Appendix CEmbedded and Industrial ComputingAppendix C: Accessing the Digital Accelerometer Data from the LVC-55

Strona 34

TTaTTable of Contentsbeable of Contents4Chapter 1: Introduction 5System Specication . . . . . . . . . . . . . . . . . . . . .

Strona 35

40Accessing the Digital Accelerometer Appendix CEmbedded and Industrial Computing while (1) { short x = (short) ich7_SM_ReadByte (0x1d, DATA

Strona 36

41Accessing the GPS DataAppendix DEmbedded and Industrial ComputingAppendix D: Accessing the GPS Data from the LVC-5570The LVC-5570 employs an on

Strona 37

42Accessing the GPS DataAppendix DEmbedded and Industrial ComputingSpecify the following communication parameters:Bits per Second: 9600Data Bits: 8Par

Strona 38

43Programming Watchdog TimerEmbedded and Industrial ComputingAppendix EAppendix E: Programming System Watchdog Timer of the LVC-5570A watchdog time

Strona 39 - Appendix C

44Programming Watchdog TimerEmbedded and Industrial ComputingAppendix E “ Watchdog Set Watchdog timer.\n”\ “ CaseOpen

Strona 40

45Programming Watchdog TimerEmbedded and Industrial ComputingAppendix E// Clear case open stateint mCaseOpen_Clear (int argc, char* argv[]){ CHECK_A

Strona 41 - Appendix D

46Programming Watchdog TimerEmbedded and Industrial ComputingAppendix E {“DIO_IN” , mDIO_IN }, {“DIO_OUT” , mDIO_OUT }, {“PIO” , mPI

Strona 42

47Terms and ConditionsAppendix FEmbedded and Industrial ComputingAppendix F: Terms and ConditionsWarranty Policy All products are under warranty

Strona 43 - Appendix E

48Terms and ConditionsAppendix FEmbedded and Industrial ComputingRMA Service Request Form When requesting RMA service, please fill out the following

Strona 44

5IntroductionChapter 1Embedded and Industrial ComputingChapter 1: IntroductionThank you for choosing the LVC-5570. The LVC-5570 is an ultra-robus

Strona 45

6IntroductionChapter 1Embedded and Industrial ComputingPackage ContentsYour package contains the following items:LVC-5570 Fanless Embedded System with

Strona 46

7System ComponentsChapter 2Embedded and Industrial ComputingChapter 2: System ComponentsSystem DrawingMechanical dimensions of the LVC-5570 wit

Strona 47 - Appendix F

8System ComponentsChapter 2Embedded and Industrial ComputingBlock Diagram: The MainBoardThe block diagram depicts the relationships among the in

Strona 48

9System ComponentsChapter 2Embedded and Industrial ComputingBlock Diagram: The Ignition BoardThe block diagram depicts the relationship between the p

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